Solder paste print qualification using laser triangulation

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 20, Issue 3, 1997, Pages 174-182

  Lathrop, Richard R ^a  

^a Heraeus Cermalloy Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LASER APPLICATIONS; PHOTOLITHOGRAPHY; SENSORS; SOLDERING ALLOYS;

LASER TRIANGULATION; SOLDER PASTES; WET PRINT MEASUREMENTS;

PRINTED CIRCUIT MANUFACTURE;

EID: 0031175921     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.649437     Document Type: Article

References (5)

1. Point Range Sensor User's Guide Feb. 1995 CyberOptics Corporation 1
2. S. K. Case R. A. Kutz M. E. Ridle 3-D inspection for quality control in surface mount manufacturing SMTCON SMTCON 1990-Mar.
3. Everything you wanted to know about fine-pitch printing Transition Automat. 11 12 1992
4. S. H. Mannan N. N. Ekere R. Ismail E. K. Lo Squeegee deformation study in the stencil printing of solder pastes IEEE Trans. Comp. Packag., Manufact. Technol. 17 470 476 1994 95 7559 311758
5. W. D. Von Voss D. F. Lutnis S. K. Case J. E. Bolkom Measure solder paste in the third dimension Electron. Packag. Prod. 29 42 44 1989