How voids develop in BGA solder joints

Surface mount technology

Volumn 10, Issue 1, 1996, Pages

  O'Hara, Wanda B ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DUCTILITY; ELECTRONICS PACKAGING; RELIABILITY; STRENGTH OF MATERIALS; SURFACE MOUNT TECHNOLOGY; VISCOSITY;

BALL GRID ARRAY (BGA); LEAD COPLANARITY; MASS REFLOW; SOLDER BRIDGING; SOLDERABILITY;

SOLDERED JOINTS;

EID: 0029770607     PISSN: 08933588     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)