Pitfalls an engineer needs to be aware of during vibration testing

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1887-1892

  Malatkar, Pramod ^a   Shaw, Fong Wong ^a   Pringle, Troy ^a   Loh, Wei Keat ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BGA PACKAGE; ELECTRONIC COMPONENTS; VIBRATION LOADING;

COMPUTER SIMULATION; ELECTRICAL ENGINEERING; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; VIBRATION MEASUREMENT;

ELECTRONICS INDUSTRY;

EID: 33845592786     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645918     Document Type: Conference Paper

References (8)

1. Nayfeh, A. H., Nonlinear Interactions. Wiley (New York, 2000).
2. Nayfeh, A. H. and Mook, D. T., Nonlinear Oscillations, Wiley (New York, 1979).
3. Wikipedia, http://www.wikipedia.org.
4. Harris, C. M. and Crede, C. E., Shock and Vibration Handbook Volume 1 - Basic Theory and Measurements, McGraw-Hill (New York, 1961).
5. LDS, Application Note AN014 on Understanding FFT Windows, http://www.lds-group.com/docs/site_documents/AN014 Understanding FFT Windows.pdf
6. CAPGO Pty Ltd, Document on Understanding Noise in Measurement, http://www.capgo.com/Resources/Measurement/Noise/Noise.html
7. st International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 2005.
8. Steinberg, D. S., Vibration Analysas for Electronic Equipment Wiley (New York, 2000).