Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 46-52

  Ebbens, Stephen ^a   Hutt, David A ^a   Liu, Changqing ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; AMPLITUDE MODULATION; CHEMICAL SENSORS; CLADDING (COATING); COMPUTER AIDED DESIGN; COPPER; ELECTRON ENERGY LEVELS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; INK; JETS; MANUFACTURE; MISSILE BASES; MONOLAYERS; ORGANIC POLYMERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; PRINTING; TECHNOLOGY;

ALKANE THIOLS; CIRCUIT PATTERNING; COPPER TRACKS; FEATURE SIZES; FLUID PROPERTIES; INK-JET PRINTING; PACKAGING TECHNOLOGIES; PRINTED CIRCUIT BOARD (PCB); SAM FORMATION; SELF-ASSEMBLED MONOLAYER; SOLDER WETTING; WET ABILITY;

SELF ASSEMBLED MONOLAYERS;

EID: 35348861052     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342689     Document Type: Conference Paper

References (12)

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