Deformable silicon electronics using segmentation and flexible interconnect

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1544-1549

  Zoumpoulidis, T ^a   Wang, L ^b   Bartek, M ^a   Jansen, K M B ^b   Ernst, L J ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Flexible electronics; Flexible interconnects; RF ID tags; Ultra thin electronics

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC POWER SYSTEM INTERCONNECTION; POLYMER FILMS; SINGLE CRYSTALS; THICK FILMS; ULTRATHIN FILMS;

FLEXIBLE ELECTRONICS; FLEXIBLE INTERCONNECTS; RF-ID TAGS; ULTRA-THIN ELECTRONICS;

ELECTRONIC EQUIPMENT;

EID: 35348860101     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374000     Document Type: Conference Paper

References (9)

1. R. Dekker, M. Dümling, J.-H Fock, O. Gourhant, C. Jonville, R. Kubrin, T.M. Michielsen, H. Pohlmann, W. Schnitt, A.M.H. Tombeur, T. Zoumpoulidis, "CIRCONFLEX: an Ultra-Thin and Flexible Technology for RF-ID Tags", Proc. EMPC 2005, Brugge, Belgium, June 12-15, pp. 268-271, 2005.
2. L. Wang, K.M.B. Jansen, M. Bartek, A. Polyakov, L.J. Ernst, "Bending and Stretching Studies on Ultra-thin Silicon Substrates", 6th International Conference on Electronic Packaging Technology, 2005.
3. T. Zoumpoulidis, L. Wang, M. Bartek, K.M.B. Jansen, A. Polyakov, S. Sosin, L.J. Ernst, R. Dekker, J.N. Burghartz , "Flexible Interconnects for Deformable Ultra-Thin Substrates", Proc. 39th International Symposium on Microelectronics (IMAPS 2006), San Diego, USA, October 2006, pp. 204-210.
4. V.J. Lumelsky, M.S. Shur, S. Wagner, "Sensitive Skin", IEEE Transactions on Sensors, Vol.1, NO.1, June 2001, pp. 41-51.
5. D. Brosteaux, F. Axisa, J. Vanfleteren, N. Carchon, M. Gonzalez, "Elastic Interconnects for Stretchable Electronic Circuits using MID (Moulded Interconnect Device) Technology using MID in polymer", Mater. Res. Soc. Symp. Proc. Vol. 926, 2006 Materials Research Society.
6. R. Dekker. P.G.M. Baltus, H.G.R. Maas, "Substrate Transfer for RF Technologies", IEEE Transactions on Electron Devices, Vol. 50, No.3, March 2003, pp. 747-757.
7. R. Dekker, Substrate Transfer Technology, PhD thesis, Delft University of Technology, ISBN 90-74445-61-6, June 2004.
8. L. Wang, K.M.B. Jansen, M. Bartek, A. Polyakov, L.J. Ernst, "Mechanical Characterization Analysis of a Segmented Silicon Layer on Ultra-thin Polyimide Substrates by Experiment and FE Simulation", EuroSimE2006, Como Italy, April 2006, pp 251-256.
9. T. Löher, D. Manessis, R. Heinrich, B. Schmied, J. Vanfleteren, J. Debaets, A. Ostmann, H. Reichl, "Stretchable Electronic Systems", The 8th Electronics Packaging Technology Conference, 6-8 December 2006, Singapore, pp.271-276.