Elastic interconnects for stretchable electronic circuits using MID (Moulded Interconnect Device) technology

Materials Research Society Symposium Proceedings

Volumn 926, Issue , 2006, Pages 82-89

  Brosteaux, Dominique ^a   Axisa, Fabrice ^b   Vanfleteren, Jan ^a,b   Carchon, Nadine ^b   Gonzalez, Mario ^b  

^a GHENT UNIVERSITY   (Belgium)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMEDICAL ENGINEERING; ELASTICITY; LIGHT EMITTING DIODES; ROBOTICS; SILICONES;

METALLIC WIRING; STRETCHABILITY; THICK SILICONE MATERIALS;

LARGE SCALE SYSTEMS;

EID: 33947651535     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0926-cc08-03     Document Type: Conference Paper

References (6)

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2. S.P. Lacour, J. Jones, S. Wagner, T. Li, S. Zhigang, "Stretchable Interconnects for Elastic Electronic Surfaces", Proceedings of IEEE, Vol. 93, No. 8, august 2005.
3. S.P. Lacour, J. Jones, S. Wagner, "Design and Performance of Thin Metal Film Interconnects for Skin-Like Electronic Circuits", IEEE Electron Device Letters, Vol.25, No4, April 2004
4. M.N. Maghribi, PhD Thesis LLNL, Preprint UCRL-LR-153347, 2003
5. T.A. Green, M.J. Liew, S. Roy, "Electrodeposition of Gold from a Thiosulfate-Sulfite Bath for Microelectronic Applications", Journal of the electrochemical society, 150(3),C104-C110,2003
6. C.P Wong, "High Performance Screen Printable Silicone as Selective Hybrid IC Encapsulant", IEEE Transactions on components, hybrids and manufacturing technology, Vol. 13, No4, December 1990