Bending and stretching studies on ultra-thin silicon substrates

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Wang, L ^a   Jansen, K M B ^a   Bartek, M ^b   Polyakov, A ^b   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; FAILURE ANALYSIS; POLYIMIDES; SINGLE CRYSTALS; STRAIN MEASUREMENT; TENSILE STRESS; TENSILE TESTING;

DIELECTRIC LAYERS; HEXAGONAL SEGMENTATIONS; TENSILE LOADS; TENSILE TOOLS;

SEMICONDUCTING SILICON;

EID: 33846316353     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564634     Document Type: Conference Paper

References (7)

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