Mechanical characterization analysis of a segmented silicon layer on ultra-thin polyimide substrates by experiment and FE simulation

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Wang, L ^a   Jansen, K M B ^a   Bartek, M ^b   Polyakov, A ^b   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACKS; DIELECTRIC MATERIALS; FAILURE (MECHANICAL); LITHOGRAPHY; POLYIMIDES; SINGLE CRYSTALS;

GLASS CYLINDERS; SINGLE CRYSTALLINE SILICON; SQUARE SEGMENTATIONS; ULTRA-THIN POLYIMIDE;

SILICON;

EID: 33847102337     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1643980     Document Type: Conference Paper

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