Flexible interconnects for deformable ultra-thin substrates

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 204-210

  Zoumpoulidis, T ^a   Wang, L ^b   Bartek, M ^a   Jansen, K M B ^b   Polyakov, A ^a   Sosin, S ^a   Ernst, L J ^d   Dekker, R ^c   Burghartz, J N ^a,b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

^d Institut fur Mikroelektronik Stuttgart   (Germany)

Author keywords

Deformable substrate; Flexible interconnect; Sensory skin; Silicon segmentation

Indexed keywords

CRYSTALLINE SILICON FILMS; CURVED SURFACES; ELECTRICAL INTERCONNECTS; FLEXIBLE INTERCONNECT; FLEXIBLE INTERCONNECTS; MECHANICAL RELIABILITY; RELIABILITY COMPARISONS; SUBSTRATE TRANSFER;

METALLIC FILMS; MICROELECTRONICS; RELIABILITY; SILICON;

DEFORMATION;

EID: 84876555130     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. R. Dekker, M. Diimling, J.-H Fock, O. Gourhant, C. Jonville, R. Kubrin, T.M. Michielsen, H. Pohlmann, W. Schnitt, A.M.H. Tombeur, T. Zoumpoulidis, "CIRCONFLEX: an Ultra-Thin and Flexible Technology for RF-ID Tags", Proc. EMPC 2005. Brugge. Belgium. June 12-15. pp. 268-271. 2005.
2. th International Conference on Electronic Packaging Technology. 2005.
3. R. Dekker, P.G.M. Baltus, H.G.R. Maas. "Substrate Transfer for RF Technologies", IEEE Transactions on Electron Devices. Vol. 50. No.3, March 2003. pp. 747-757.