Thermosonic wire bonding process simulation and bond pad over active stress analysis

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 383-391

  Liu, Yong ^a   Irving, Scott ^a   Luk, Timwah ^a  

^a FAIRCHILD SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND PAD OVER ACTIVE (BPOA) DESIGN; SEMICONDUCTOR CHIPS; STRESS IMPACT; THERMOSONIC WIRE BONDING;

BONDING; FINITE ELEMENT METHOD; FRICTION; SILICON; STRESS ANALYSIS; THERMAL EFFECTS; ULTRASONICS;

ELECTRIC WIRE;

EID: 10444239271     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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9. Mayer, M., Paul, O., Bolliger, D. and Baltes, H., "Integrated Temperature Microsensores for Characterization and Optimization of Thermosonic Ball Bonding Process", Proceedings of 49 th Electronic Components and Technology Conference, San Diego, California, May1991, pp463-468.
10. Tan, C.T. and Gan, Z.H., "Failure Mechanisms of Aluminum Bond Pad Peeling During Thermosonic Bonding", IEEE Transactions on Device and Materials Reliability, Vol.3, No.2, June, 2003, pp 44-50.