Comparison of bonding defects for longitudinal and transverse thermosonic flip-chip

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 350-355

  Leung, M L H ^a,b   Lai Wah, H C ^a   Chou Kee, P L ^b  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CHUCKS; DEFECTS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; GEOMORPHOLOGY; SILICON; STRESS ANALYSIS; TRANSDUCERS; ULTRASONIC APPLICATIONS; ULTRASONIC EFFECTS;

COMPRESSIVE LOADING; FLIP-CHIP TECHNIQUES; LASER VIBROMETERS; LONGITUDINAL MODES; MAXIMUM PRINCIPAL STRESS; THERMOSONIC FLIP-CHIP BONDING; ULTRASONIC VIBRATION; VIBRATION AMPLITUDE;

CHIP SCALE PACKAGES;

EID: 84954062915     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271544     Document Type: Conference Paper

References (6)

1. Tan, Q, Zhang. W, Schaible, B, Bond. J, Ju. T.H, Lee. Y.C. "Thermosonic Flip-Chip Bonding Using Longitudinal Ultrasonic Vibration," IEEE Trans-CMPT-B, Vol.21 No.1 (1998), pp. 53-58.
2. Harman, G, Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield, McGraw-Hill (New-York, 1997), pp203-207
3. Tan, C.M, Gan, Z. "Failure Mechanisms of Aluminum Bondpad Peeling During Thermosonic Bonding", IEEE-Device and Materials Reli, Vol. 3, No 2 (2003), pp44-50
4. Hizukuri, M, Watanabe. N, Asano. T. "Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding', Jpn. J. Appl. Phys, Vol 40 (2001) pp3044-3048
5. Willems, N, et al, Strength of Materials, McGraw-Hill (New York-1991), pp310-319
6. Stepin, P, Strength of Materials, Gordon and Breach, (New York - 1963)