Characterization of polymer thin films sputtered onto a copper substrate with two kinds of polyimide targets

Molecular Crystals and Liquid Crystals

Volumn 471, Issue 1, 2007, Pages 99-111

  Iwamori, Satoru ^a   Kezuka, Kazuya ^a   Uemura, Akihiro ^a,b  

^a KANAZAWA UNIVERSITY   (Japan)

^b Nakai Techno Co Ltd   (Japan)

Author keywords

Adhesion strength; Copper substrate; Friction coefficient; Polyimide; RF sputtering; Thin film, wear durability

Indexed keywords

BOND STRENGTH (MATERIALS); CHARACTERIZATION; COPPER; FRICTION; LAMINATES; POLYIMIDES; SPUTTERING; SUBSTRATES;

COPPER SUBSTRATES; RF SPUTTERING; WEAR DURABILITY;

POLYMER FILMS;

EID: 34848890569     PISSN: 15421406     EISSN: 15635287     Source Type: Journal    
DOI: 10.1080/15421400701545411     Document Type: Conference Paper

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