Characterization and tribological properties of two polyimide thin films sputtered onto a copper substrate

Journal of Adhesion Science and Technology

Volumn 18, Issue 15-16, 2004, Pages 1771-1781

  Iwamori, Satoru ^a   Uemura, Akihiro ^a   Yamada, Yoshinori ^a  

^a KANAZAWA UNIVERSITY   (Japan)

Author keywords

Adhesion; Polyimide; Sputtering; Thin film; Tribology

Indexed keywords

ADHESION; COPPER; DEGRADATION; POLYIMIDES; SPUTTERING; SUBSTRATES; THERMODYNAMIC STABILITY; TRIBOLOGY; CHEMICAL BONDS; CONTACT ANGLE; INTERFACIAL ENERGY; SURFACE CHEMISTRY; VULCANIZATION AGENTS; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESION DEGRADATION; CATHODE PLATES; CHEMICAL STABILITY; COPPER SUBSTRATES;

THIN FILMS;

CHEMICAL BONDING STATE; COPPER SUBSTRATES; ELEMENTAL COMPOSITIONS; FRICTION COEFFICIENTS; METHYLENE IODIDE; NITROGEN CONCENTRATIONS; POLAR COMPONENTS; POLYIMIDE THIN FILMS; RF-SPUTTERING; SURFACE ENERGIES; TRIBOLOGICAL PROPERTIES;

EID: 13444301235     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/1568561042708331     Document Type: Article

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