Comparison of the interfacial thermal resistivity of silver and solder die-attach using laser flash technique

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 45-49

  Zhang, Zhiye ^a   Calata, Jesus Noel ^a   Suchicital, Carlos ^a   Lu, Guo Quan ^a   Hasselman, D P H ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

Interfacial thermal resistance; Laser flash technique; Silver die attach; Solder die attach

Indexed keywords

INTERFACIAL THERMAL RESISTANCE; LASER FLASH TECHNIQUES; SILVER DIE ATTACH; SOLDER DIE ATTACH;

DIES; FINITE ELEMENT METHOD; HEAT RESISTANCE; INTERFACES (MATERIALS); LASER APPLICATIONS; MATHEMATICAL MODELS; SOLDERING ALLOYS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 4444299379     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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