Development of molded liquid crystal polymer surface mount packages for millimeter wave applications

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2005, Issue , 2005, Pages 167-170

  Aihara, Kunia ^a   Chen, Andy C ^a   Pham, Anh Vu ^a   Roman, John W ^b  

^a University of California   (United States)

^b RJR Polymers   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MILLIMETER WAVE APPLICATIONS; QUAD FLAT NO-LEAD (QFN);

ELECTRIC LINES; ELECTRONICS PACKAGING; INSERTION LOSSES; MILLIMETER WAVES; SURFACE MOUNT TECHNOLOGY; WAVEGUIDES;

LIQUID CRYSTAL POLYMERS;

EID: 33646423344     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2005.1563728     Document Type: Conference Paper

References (4)

1. N. Chen, K. Chiang, T.D. Her, Y.L. Lai and C. Chen, "Electrical Characterization of Quad Flat Non-Lead Package for RFIC Applications," Semiconductor Device Research Symposium, pp. 266-269, Dec. 2001
2. A.C.W. Lu, D.J. Xie, Z.F. Shi and W. Ryu, "Electrical and Thermal Modelling of QFN Packages," Electronics Packaging Technology Conference, pp. 352-356, 2000
3. R.J. Ross, "LCP Injection Molded Packages - Keys to JEDEC 1 Performance," Electronic Components and Technology Conference, pp. 1807-1811, 2004
4. R. Yang, "A flex circuit substrate option," Advanced Packaging, March 2002 〈http://ap.pennnet.com/Articles/Article_Display.cfm?Section= Archives&Subsection=Display&ARTICLE_ID=1371 85&KEYWORD=LCP〉