Millimeter-wave monolithic GaAs IC interconnect and packaging technology trends in Japan

Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit)

Volumn , Issue , 1999, Pages 105-108

  Ohata, Keiichi ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CERAMIC MATERIALS; FLIP CHIP DEVICES; MILLIMETER WAVE DEVICES; SEMICONDUCTING GALLIUM ARSENIDE;

FLIP CHIP BONDING;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0033356995     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)