Development and characterization of thermal enhancement structures for single-phase liquid cooling in microelectronics systems

Heat Transfer Engineering

Volumn 28, Issue 12, 2007, Pages 997-1007

  Zhang, H Y ^a   Pinjala, D ^a   Joshi, Y K ^b   Wong, T N ^c   Toh, K C ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HEAT LOSSES; HEAT SINKS; MICROCHANNELS; MICROELECTRONICS; PRESSURE DROP;

LIQUID COOLING; METALLIC FOAM HEAT SINKS (MFHS); MICROELECTRONICS SYSTEMS; THERMAL ENHANCEMENT STRUCTURES;

COOLING SYSTEMS;

EID: 34648828867     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630701483620     Document Type: Article

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