Fluid flow and heat transfer characteristics of liquid cooled foam heat sinks

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 640-647

  Zhang, H Y ^a   Pinjala, D ^a   Joshi, Y K ^b   Wong, T N ^c   Toh, K C ^c   Iyer, M K ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electronics cooling; Flip chip BGA (FBGA); Foam heat sink (FHS); Microchannel heat sink (microchannel HS); Pressure drop; Pump power; Thermal resistance

Indexed keywords

ELECTRONICS COOLING; FOAM HEAR SINKS (FHS); MICROCHANNEL HEAT SINKS (MICROCHANNEL HS); PUMP POWER;

COOLING; COPPER; FLOW OF FLUIDS; FOAMS; HEAT RESISTANCE; HEAT TRANSFER; POROSITY; PRESSURE DROP; SINTERING;

HEAT SINKS;

EID: 4444241905     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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