Thermal modeling and design of liquid cooled heat sinks assembled with flip chip ball grid array packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 431-437

  Zhang, H Y ^a   Pinjala, D ^a   Joshi, Y K ^b   Wong, T N ^c   Toh, K C ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FLIP CHIP DEVICES; HEAT FLUX; HEAT RESISTANCE; HEAT SINKS; MATHEMATICAL MODELS; NATURAL CONVECTION;

FLIP CHIP BALL GRID ARRAY PACKAGES; MICROCHANNEL HEAT SINK; THERMAL MODELING;

ELECTRONICS PACKAGING;

EID: 0038012795     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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