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Volumn 46, Issue 9 B, 2007, Pages 6135-6139
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Double-patterning technique using plasma treatment of photoresist
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Author keywords
Double patterning technique; Extremely low k1; Pattern decomposition; Plasma treatment technique; Si thin film passivation
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Indexed keywords
ETCHING;
PASSIVATION;
PLASMA APPLICATIONS;
THIN FILMS;
DOUBLE PATTERNING TECHNIQUE (DPT);
DOUBLE-PATTERNING TECHNIQUE;
NUMERICAL APERTURE;
OPTICAL PROXIMITY CORRECTION (OPC);
PATTERN DECOMPOSITION;
SI THIN-FILM PASSIVATION;
PHOTORESISTS;
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EID: 34648819081
PISSN: 00214922
EISSN: 13474065
Source Type: Journal
DOI: 10.1143/JJAP.46.6135 Document Type: Article |
Times cited : (7)
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References (12)
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