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Volumn 18, Issue 35, 2007, Pages
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High aspect ratio silicon nanomoulds for UV embossing fabricated by directional thermal oxidation using an oxidation mask
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Author keywords
[No Author keywords available]
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Indexed keywords
ETCHING;
MASKS;
MOLDING;
OXIDATION;
PHOTOLITHOGRAPHY;
POLYDIMETHYLSILOXANE;
SILICON;
NANOEMBOSSING;
NANOMOULDING;
SILICON ETCHING;
NANOSTRUCTURED MATERIALS;
DIMETICONE;
GOLD;
SILICON;
SILICON NITRIDE;
ANALYTIC METHOD;
ARTICLE;
CHEMICAL ANALYSIS;
CHEMICAL BINDING;
ELECTRODE;
NANOANALYSIS;
OXIDATION KINETICS;
PRIORITY JOURNAL;
ULTRAVIOLET RADIATION;
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EID: 34548679169
PISSN: 09574484
EISSN: 13616528
Source Type: Journal
DOI: 10.1088/0957-4484/18/35/355307 Document Type: Article |
Times cited : (9)
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References (14)
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