Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

Wear

Volumn 263, Issue 7-12 SPEC. ISS., 2007, Pages 1459-1466

  Cai, M B ^a   Li, X P ^a   Rahman, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Dynamic hard particles; Groove wear; Molecular dynamics; Nanoscale cutting; Silicon

Indexed keywords

AMORPHOUS MATERIALS; BOND LENGTH; DIAMOND CUTTING TOOLS; HARDNESS; THERMAL EFFECTS; WEAR OF MATERIALS;

CONVENTIONAL CUTTING PROCESSES; DYNAMIC HARD PARTICLES; GROOVE WEAR; NANOSCALE CUTTING; TOOL FLANK;

SILICON WAFERS;

AMORPHOUS MATERIALS; BOND LENGTH; DIAMOND CUTTING TOOLS; HARDNESS; SILICON WAFERS; THERMAL EFFECTS; WEAR OF MATERIALS;

EID: 34548050714     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2006.11.030     Document Type: Article

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