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Volumn 201, Issue 22-23 SPEC. ISS., 2007, Pages 8976-8980
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Characterization of SiO2 films deposited at low temperature by means of remote ICPECVD
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Author keywords
Electrical characterization; PECVD; Silane; Silicon dioxide
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Indexed keywords
CHARACTERIZATION;
DEPOSITION RATES;
ELECTRIC PROPERTIES;
FILM GROWTH;
FILMS;
INDUCTIVELY COUPLED PLASMA;
LEAKAGE CURRENTS;
SILICA;
SURFACE CHEMISTRY;
ELECTRICAL CHARACTERIZATION;
POSITIVE CHARGE;
SILICON DIOXIDE FILMS;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
CHARACTERIZATION;
DEPOSITION RATES;
ELECTRIC PROPERTIES;
FILM GROWTH;
FILMS;
INDUCTIVELY COUPLED PLASMA;
LEAKAGE CURRENTS;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SILICA;
SURFACE CHEMISTRY;
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EID: 34547699727
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2007.04.039 Document Type: Article |
Times cited : (24)
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References (15)
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