Thermal resistance measurement of LEDs with multi-chip packages

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 2006, Issue , 2006, Pages 186-190

  Kim, Lan ^a   Shin, Moo Whan ^a  

^a Myong Ji University   (South Korea)

Author keywords

GaN based; LED; Multi chip; Thermal capacitance; Thermal resistance

Indexed keywords

CHIP SCALE PACKAGES; GALLIUM NITRIDE; HEAT LOSSES; HEAT RESISTANCE; MULTICHIP MODULES; SEMICONDUCTOR JUNCTIONS;

GAN-BASED LEDS; MULTI-CHIP DESIGNS; THERMAL CAPACITANCE; THERMAL DESIGN;

LIGHT EMITTING DIODES;

EID: 33750132692     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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