Raman thermometry of polysilicon microelectro-mechanical systems in the presence of an evolving stress

Journal of Heat Transfer

Volumn 129, Issue 3, 2007, Pages 329-334

  Abel, Mark R ^a   Graham, Samuel ^a   Serrano, Justin R ^b   Kearney, Sean P ^b   Phinney, Leslie M ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

MEMS; Raman spectroscopy; Thermal stresses; Thermometry

Indexed keywords

CALIBRATION; POLYSILICON; RAMAN SPECTROSCOPY; TEMPERATURE MEASUREMENT; THERMAL STRESS;

LINEWIDTH BROADENING METHOD; POLYSILICON MICROHEATER; RAMAN STOKES PEAK LOCATION; THERMOMETRY;

MEMS;

CALIBRATION; MEMS; POLYSILICON; RAMAN SPECTROSCOPY; TEMPERATURE MEASUREMENT; THERMAL STRESS;

EID: 34547262356     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2409996     Document Type: Article

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