Bonding pad resistance. A combined approach

2001 International Conference on Modeling and Simulation of Microsystems - MSM 2001

Volumn , Issue , 2001, Pages 442-445

  Bouche, G ^a   Gohella, R ^a   Sabouret, E ^a  

^a STMICROELECTRONICS   (France)

Author keywords

Bonding pad; Compression test; Mechanical stress; Reliability; Simulation

Indexed keywords

BONDING; COMPRESSION TESTING; COMPRESSIVE STRESS; COMPUTER SIMULATION; ELECTRIC RESISTANCE; METALLIZING; OPTIMIZATION; RELIABILITY THEORY; STRUCTURE (COMPOSITION);

BONDING PADS; COMPRESSIVE LOADS; MECHANICAL STRESSES;

INTERMETALLICS;

EID: 6344257165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Ansys® 5.6 User Guide, 2000.
2. G. Bouche, R. Gonella, E. Sabouret, Bonding pad under shearing stress, to be published, 2000.
3. M.Y. He, J. Lipkin, D. R. Clarke, A.G. Evans and M. Tenhover, Residual stresses in dielectrics caused by metallization lines and pads, Acta Mater. Vol.44 No6, pp. 2353-2359, 1996.