A multi scale finite element methodology to evaluate wire bond pad architectures

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 648-655

  Fiori, V ^a   Orain, S ^b  

^a STMICROELECTRONICS   (France)

^b PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

LINEAR THREE DIMENSIONAL ANALYSIS; LOCAL STRESS FIELD; REPRESENTATIVE UNIT CELL (RUC); WIRE BONDING PROCESS MODELING;

ASPECT RATIO; FAILURE ANALYSIS; FINITE ELEMENT METHOD; LINEAR ALGEBRA; MATHEMATICAL MODELS; STRESSES;

MICROELECTRONICS;

EID: 33745698071     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502882     Document Type: Conference Paper

References (12)

1. Rasco M., Mosig K., Ling J., Elenius P., Augur R., Packaging assessment of porous ultra low-k materials.
2. Xu G. and al., Cohesive strength characterization of brittle low-k films.
3. Huang T.C., Liang B., Lee T.L., Chen S.C., Yu C.H., Liang M.S., Wire Bonding failure mechanisms and simulation of Cu low-K IMD chip packaging.
4. Saran M. and at., Elimination of bond-pad damage through structural reinforcement of intermetal dielectrics, International reliability Physics Symposium, 1998.
5. Bouche G. and al., Bonding pad resistance. A combined approach, Proceedings of the MSM 2001 conference, Hilton heald.
6. Mercado L., Goldberg C., Kuo S-M., A simulation method for predicting mechanical reliability with low-k dielectrics.
7. Yeh C-L., Lai Y-S., Wu J-D., Dynamic analysis of Wirebonding process on Cu/low-k Wafers, 2003, IEEE.
8. Binner R., Schopper A., Gold Wire Bonding on low-k Material. A new challenge for Interconnection Technology, 2004, IEEE.
9. Ker M-D., Peng J-J., Fully Process Compatible Layout Design on Bond Pad to improve Wire Bond Reliability in CMOS IC's, 2002, IEEE.
10. ANSYS® 8.0 Documentation, Theory Manual, 2, 1 Structural Fundamentals.
11. Sundararaman V., Edwards D.R., Subido W.E., Test H.R., Wire Pull on fine Pitch Pads: An obsolete test for first bond integrity ? IEEE, 2000.
12. Degryse D., Vandevelde B., Stoukatch S., Beyne E., Mechanical behavior of BEOL structures containing Low K dielectrics during Bonding Process, 2003, EPTC.