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Volumn 2006, Issue , 2006, Pages 549-552

Finite difference modeling of multiple planes in packages

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT THEORY; FINITE DIFFERENCE METHOD; MATHEMATICAL MODELS; SPURIOUS SIGNAL NOISE;

EID: 33751066124     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/emczur.2006.214993     Document Type: Conference Paper
Times cited : (13)

References (10)
  • 2
    • 0036589412 scopus 로고    scopus 로고
    • Modeling of multilayered power distribution planes using transmission matrix method
    • May
    • J.-H. Kim and M. Swaminathan, "Modeling of multilayered power distribution planes using transmission matrix method," IEEE Trans. Adv. Packag., vol. 25, no. 2, pp. 189-199, May 2002.
    • (2002) IEEE Trans. Adv. Packag. , vol.25 , Issue.2 , pp. 189-199
    • Kim, J.-H.1    Swaminathan, M.2
  • 3
    • 0033310487 scopus 로고    scopus 로고
    • Accurate power supply and ground plane pair models [for MCMs]
    • Aug.
    • K. L. H. Wu, J. Meyer and A. Barber, "Accurate power supply and ground plane pair models [for MCMs]," IEEE Trans. Adv. Packag., vol. 22, no. 3, pp. 259-266, Aug. 1999.
    • (1999) IEEE Trans. Adv. Packag. , vol.22 , Issue.3 , pp. 259-266
    • Wu, K.L.H.1    Meyer, J.2    Barber, A.3
  • 4
    • 15944396138 scopus 로고    scopus 로고
    • Parallel plate slot coupler modeling using two dimensional frequency domain transmission line matrix method
    • Oct.
    • R. Ito, "Parallel plate slot coupler modeling using two dimensional frequency domain transmission line matrix method," in Proc. Electrical Performance of Electronic Packaging, Oct. 2004, pp. 41-44.
    • (2004) Proc. Electrical Performance of Electronic Packaging , pp. 41-44
    • Ito, R.1
  • 5
    • 20444403734 scopus 로고    scopus 로고
    • Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs
    • May
    • M. I. H. K. J. Lee, M. Rotaru and J. Kim, "Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs," IEEE Trans. Adv. Packag., vol. 28, no. 2, pp. 298-309, May 2005.
    • (2005) IEEE Trans. Adv. Packag. , vol.28 , Issue.2 , pp. 298-309
    • Lee, M.I.H.K.J.1    Rotaru, M.2    Kim, J.3
  • 6
    • 0035422035 scopus 로고    scopus 로고
    • Modeling of field penetration through planes in multilayered packages
    • Aug.
    • J. C. M. S. J. Mao, J. Srinivasan and N. Do, "Modeling of field penetration through planes in multilayered packages," IEEE Trans. Adv. Packag., vol. 24, no. 3, pp. 326-333, Aug. 2001.
    • (2001) IEEE Trans. Adv. Packag. , vol.24 , Issue.3 , pp. 326-333
    • Mao, J.C.M.S.J.1    Srinivasan, J.2    Do, N.3
  • 7
    • 0141917561 scopus 로고    scopus 로고
    • A simple finite-difference frequency-domain (FDFD) algorithm for analysis of switching noise in printed circuit boards and packages
    • May
    • V. S. O. Ramahi and B. Archambeault, "A simple finite-difference frequency-domain (FDFD) algorithm for analysis of switching noise in printed circuit boards and packages," IEEE Trans. Adv. Packag., vol. 26, no. 2, pp. 191-198, May 2003.
    • (2003) IEEE Trans. Adv. Packag. , vol.26 , Issue.2 , pp. 191-198
    • Ramahi, V.S.O.1    Archambeault, B.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.