A new method for preparation of direct bonding copper substrate on Al2O3

Materials Letters

Volumn 61, Issue 19-20, 2007, Pages 4131-4133

  He, Hong ^a   Fu, Renli ^a   Wang, Deliu ^a   Song, Xiufeng ^a   Jing, Min ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Ceramics; Direct Bonding Copper (DBC); Interface; Thermal properties

Indexed keywords

BONDING; COPPER; EUTECTICS; INTERFACES (MATERIALS); METAL FOIL; QUENCHING; SUBSTRATES; THERMAL CYCLING; THERMODYNAMIC PROPERTIES;

ALUMINA CERAMIC SUBSTRATES; BONDING STRENGTH; COPPER FOIL; COPPER SUBSTRATES;

ALUMINA;

EID: 34250781022     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2007.01.036     Document Type: Article

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