Preoxidation of the Cu layer in direct bonding technology

Applied Surface Science

Volumn 211, Issue 1-4, 2003, Pages 250-258

  Ning, Honglong ^a   Ma, Jusheng ^a   Huang, Fuxiang ^a   Wang, Yonggang ^a   Li, Qianqian ^a   Li, Xiaoyan ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Direct bonded copper (DBC); Interface; Oxidation film; Preoxidation

Indexed keywords

ALUMINA; BONDING; CERAMIC MATERIALS; COMPOSITION EFFECTS; EUTECTICS; METAL MELTING; OXIDATION; OXYGEN; PHASE DIAGRAMS; THERMAL EFFECTS;

INTERFACE REACTIONS;

COPPER;

EID: 0038215549     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(03)00243-5     Document Type: Article

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