Water cooled DBC direct bonded copper substrates

IECON Proceedings (Industrial Electronics Conference)

Volumn 4, Issue , 1998, Pages 2350-2354

  Exel, Karl ^a   Schulz Harder, Juergen ^a  

^a Curamik Electronics GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COPPER; FLOW MEASUREMENT; HEAT LOSSES; METAL FOIL; SUBSTRATES; THERMAL INSULATING MATERIALS; WATER;

DIRECT BONDED COPPER;

ELECTRONICS PACKAGING;

EID: 0032295365     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)