|
|
|
Volumn 32, Issue 6, 2005, Pages 8-12
|
|
Advantages and new development of DBC (Direct Bond Copper) substrates
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ALUMINUM NITRIDE;
ASSEMBLY;
BENDING STRENGTH;
SEMICONDUCTOR MATERIALS;
SILICON;
ECONOMIC SOLUTION;
METALLIZED SUBSTRATES;
SEMICONDUCTOR MODULES;
COPPER;
|
|
EID: 28744445409
PISSN: None
EISSN: None
Source Type: Journal
DOI: None Document Type: Review |
|
Times cited : (8)
|
|
References (0)
|
