Investigation of temperature and strain rate behavior of lead-free solder Sn96.5Ag3.5

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2006, Pages 239-243

  Zhu, F L ^a   Zhang, H H ^a   Guan, R F ^a   Liu, S ^a,b   Yang, Y B ^c  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b Wayne State University   (United States)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 34250689972     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPFA.2006.251038     Document Type: Conference Paper

References (11)

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