Closed-form expressions for the line parameters of co-planar on-chip interconnects on lossy silicon substrates

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 341-344

  Luoh, Amy ^a   Weisshaar, Andreas ^a  

^a Oregon State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; EDDY CURRENTS; ELECTRONICS PACKAGING; SUBSTRATES;

CLOSED-FORM EXPRESSION; COMPLEX IMAGE METHOD; EQUIVALENT CIRCUIT MODEL; FREQUENCY DEPENDENT; IMPEDANCE PARAMETERS; LOW AND HIGH FREQUENCIES; MODELING METHODOLOGY; ON-CHIP INTERCONNECTS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 34250177899     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057946     Document Type: Conference Paper

References (14)

1. H. Hasegawa, M. Furukawa, and H. Yanai, "Properties of microstrip line on Si-Si02 system," IEEE Trans. Microwave Theory Tech., vol. 19, pp. 869-881, Nov. 1971.
2. J. P. K. Gilb and C. A. Balanis, "MIS slow-wave structures over a wide range of parameters," IEEE Trans. Microwave Theory Tech., vol. 40, pp. 2148-2154, 1992.
3. T. Shibata and E. Sano, "Characterization of MIS structure coplanar transmission lines for investigation of signal propagation in integrated circuits," IEEE Trans. Microwave Theory Tech., vol. 38, pp. 881-890, July 1990.
4. E. Groteluschen, L. S. Dutta and S. Zaage, "Full-wave analysis and analytical formulas for the line parameters of transmission lines in semiconductor substrate," Integration, the VLSI journal, vol. 16, pp. 33-58, 1993.
5. A. Tlkipathi, Y. C. Hahm, A. Weisshaar, and V. K. nipathi, "A Quasi-TEM spectral domain approach for calculating distributed inductance and resistance of microstrip on Si-Si02 substrate," Electron. Lett., vol. 34, No. 13, pp. 1330-1331, June 1998.
6. J. Zheng, Y. C. Hahm, V. K. Tlkipathi, and A. Weisshaar, "CAD-oriented equivalent circuit modeling of on-chip interconnects on lossy silicon substrate," IEEE 2l-an.s. Micmutaue Theory Tech., vol. 48, no. 9, Sept. 2000.
7. A. Weisshaar and H. Lan, "Accurate Closed-Form Expressions for the Frequency-Dependent Line Parameters of On-Chip Interconnects on Lossy Silicon Substrate," IEEE MTT-S International Microwave Symposium Digest, pp. 1735-1756, Phoenix, Arizona, Mav 20-25. 2001.
8. A. Weisshk, H.Lan, and A. Luoh, "Accurate Closed-Form Expressions for the Fkequency-Dependent Line Parameters of On-Chip Interconnects on Lossy Silicon Substrate," IEEE 'lians. Adv. Packaging, vol. 25, Aug. 2002.
9. P. R. Bannister, "Applications of complex image theory," Radio Science, vol. 21, No. 4, pp. 605-616, Aug. 1986.
10. F. W. Grover, Inductance Calculations, Working Formulas and Tables.New York: D. Van Nostrand Company Inc., 1946.
11. U. Am, D. F. Williams, D. K. Walker, and H. Grabinski, "Accurate electrical measurement of coupled lines on lossy silicon," Proc. IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'2000), pp. 181-184, Oct. 2000.
12. R K. Hoffman, Handbook of Micmwave Integrated Carnuits. Norwood: Artech House, 1987.
13. V. Melanovik, M. Ozgur, D. C. DeGroot, J. A. Jargon, M. Gsitsn, M. E. Zaghloul, "Characterization of broad-band transmission for coplanar waveguides on CMOS silicon substrates," IEEE Trans. Microwave Theory Tech., vol. 46, pp. 632-640, May 1998.
14. H. Grabinski, B. Konrad, and P. Nordholz, "Simple formulas to calculate the line parameters of interconnects on conducting substrates," Proc. IEEE 7th Topical Meeting on Electrical Perfonnance of Electronic Packaging (EPEP'1998), pp. 223-226.