Simple formulas to calculate the line parameters of interconnects on conducting substrates

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1998, Pages 223-226

  Grabinski, H ^a   Konrad, B ^a   Nordholz, P ^a  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CONDUCTIVE MATERIALS; ELECTRIC CONNECTORS;

CONDUCTING SUBSTRATES; SIGNAL PROPAGATION;

INTEGRATED CIRCUITS;

EID: 0032288104     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)