Hot solder dip and minimizing thermal gradients

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 513-520

  Winslow, Russell T ^a   Iyer, Ganesh R ^a   Cruza, Minerva M ^a   Selvaduray, Guna S ^b  

^a Six Sigma   (United States)

^b SAN JOSE STATE UNIVERSITY   (United States)

Author keywords

Finite element analysis; Hot solder dip; Thermal gradients; Tin whisker mitigation

Indexed keywords

ACTUAL MEASUREMENTS; AEROSPACE COMPANY; GOOD CORRELATIONS; HOT SOLDER DIP; SEMICONDUCTOR INDUSTRY; TEMPERATURE PROFILES; THERMODYNAMIC ASPECTS; TIN WHISKER;

COMPUTER SIMULATION; CRYSTAL WHISKERS; FINITE ELEMENT METHOD; MICROELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; TIN;

THERMAL GRADIENTS;

EID: 84876525321     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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