Effects of re-finishing of terminations by solder-dipping on plastic quad flatpack electronic parts

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 768-773

  Sengupta, Shirsho ^a   Das, Diganta ^a   Ganesan, Sanka ^a   Pecht, Michael ^a   Lin, T Y ^b   Rollins, William ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b MOTOROLA INC   (United States)

^c RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

RISK MITIGATION; SOLDER-DIPPING; THERMAL SHOCKS; TIN WHISKERING;

EUTECTICS; SOLDERED JOINTS; SURFACE TREATMENT; THERMOMECHANICAL TREATMENT;

ELECTRONICS PACKAGING;

EID: 33847299577     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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