On-chip liquid cooling with integrated pump technology

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 2, 2007, Pages 209-217

  Oprins, Hermans ^a,b   Van der Veken, Geert ^a,c   Nicole, Cé C S ^d   Lasance, Clemens J M ^d   Baelmans, Martine ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b IMEC   (Belgium)

^c PMA Heleon NV   (Belgium)

^d PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Electrowetting; Integrated cooling system; Liquid cooling

Indexed keywords

COOLING; DROPS; HEAT CONDUCTION; MICROCHANNELS; SEMICONDUCTING SILICON; SUBSTRATES; WETTING;

COLLING CAPACITY; COOLING RATE; ELECTROWETTING; LIQUID COOLING;

INTEGRATED CIRCUIT LAYOUT;

EID: 34249899927     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.898301     Document Type: Article

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