Cooling of integrated circuits using droplet-based microfluidics

Proceedings of the IEEE Great Lakes Symposium on VLSI

Volumn , Issue , 2003, Pages 84-87

  Pamula, Vamsee K ^a   Chakrabarty, Krishnendu ^a  

^a DUKE UNIVERSITY   (United States)

Author keywords

Cooling; Droplet; Electrowetting; Heat Removal; Hot spot; Microfluidics; Thermal Management

Indexed keywords

CAPACITANCE; ELECTRIC POTENTIAL; ELECTRIC POWER UTILIZATION; MOSFET DEVICES; THERMAL EFFECTS;

ELECTROWETTING;

INTEGRATED CIRCUITS;

EID: 0037699727     PISSN: 10661395     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/764825.764831     Document Type: Conference Paper

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