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Volumn 3, Issue , 2004, Pages 221-226

Silicon micro-channel cooling device

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; HYDROPHILICITY; NATURAL CONVECTION; SEMICONDUCTOR JUNCTIONS; SILICON; SILICON WAFERS;

EID: 17044433069     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (1)

References (9)
  • 2
    • 0033317639 scopus 로고    scopus 로고
    • Integration of cooling devices in silicon technology
    • C. Perret et al, Integration of cooling devices in silicon technology, IEEE Trans Comp Pack and Manuf Techno, pp 1780, 1999.
    • (1999) IEEE Trans Comp Pack and Manuf Techno , pp. 1780
    • Perret, C.1
  • 5
    • 0028530448 scopus 로고
    • Heat transfer characteristics of water flowing through microchannels
    • X.F. Peng, G.P. Peterson and B.X. Wang, "Heat transfer characteristics of water flowing through microchannels," Experimental Heat Transfer, vol., 7 pp. 265-283, 1994.
    • (1994) Experimental Heat Transfer , vol.7 , pp. 265-283
    • Peng, X.F.1    Peterson, G.P.2    Wang, B.X.3
  • 6
    • 0036537264 scopus 로고    scopus 로고
    • Constant-wall-temperature nusselt number in micro and nanochannels
    • N.G. Hadjiconstantinou and O. Simek. Constant-wall-temperature Nusselt number in micro and nanochannels. Journal of Heat transfer, vol. 124, 356-364, 2002.
    • (2002) Journal of Heat Transfer , vol.124 , pp. 356-364
    • Hadjiconstantinou, N.G.1    Simek, O.2
  • 7
    • 0344946483 scopus 로고    scopus 로고
    • Evolution of microchannel flow passages - Thermohydraulic performance and fabrication technology
    • S.G. Kandlikar and W.J. Grande, Evolution of microchannel flow passages - Thermohydraulic performance and fabrication technology. Heat transfer engineering, vol 24, pp.3-17, 2003.
    • (2003) Heat Transfer Engineering , vol.24 , pp. 3-17
    • Kandlikar, S.G.1    Grande, W.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.