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Volumn 3, Issue , 2004, Pages 221-226
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Silicon micro-channel cooling device
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
HEAT RESISTANCE;
HYDROPHILICITY;
NATURAL CONVECTION;
SEMICONDUCTOR JUNCTIONS;
SILICON;
SILICON WAFERS;
HIGH-POWER DENSITY ELECTRONICS;
SILICON MICRO-CHANNEL COOLING DEVICES;
SILICON MICROCHANNELS;
THERMAL OXIDATION;
COOLING SYSTEMS;
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EID: 17044433069
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (1)
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References (9)
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