SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 8, 2007, Pages 847-854

A thermally robust Ni-FUSI process using in 65 nm CMOS technology

(3) Tan, S Y a Sung, C L b Wu, W F b

a CHINESE CULTURE UNIVERSITY (Taiwan)

b NATIONAL NANO DEVICE LABORATORIES (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FULLY SILICIDED (FUSI) GATE; NICKEL SILICIDE LAYER; POLY-GATE FORMATION;

AGGLOMERATION; ANNEALING; ATOMIC FORCE MICROSCOPY; CMOS INTEGRATED CIRCUITS; CONTACT RESISTANCE; FABRICATION; MORPHOLOGY; PHASE TRANSITIONS; THERMAL CONDUCTIVITY; THERMODYNAMIC STABILITY; X RAY DIFFRACTION ANALYSIS;

GATES (TRANSISTOR);

EID: 34249877198 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-006-9088-1 Document Type: Article

Times cited : (8)

References (19)

1
- 0004245602
- The International Technology Roadmap for Semiconductors, 2005
- (2005) The International Technology Roadmap for Semiconductors

2
- 10844254841
- C. Hobbs et al., VLSI Symp. Tech. Dig. (2003), p. 9
- (2003) VLSI Symp. Tech. Dig. , pp. 9
- Hobbs, C.¹

3
- 33745463419
- K. Shiraishi et al., VLSI Symp. Tech. Dig. (2004), p. 108
- (2004) VLSI Symp. Tech. Dig. , pp. 108
- Shiraishi, K.¹

4
- 0036133199
- H. Iwai, T. Ohgura, S. Ohmi, Microelectron. Eng. 60, 157 (2002)
- (2002) Microelectron. Eng. , vol.60 , pp. 157
- Iwai, H.¹ Ohgura, T.² Ohmi, S.³

5
- 0036928692
- A. Hokazono, K. Ohuchi, M. Takayanagi, Y. Watanabe, S. Magoshi, Y. Kato, T. Shimizu et al., IEDM Tech. Dig. (2002), p. 639
- (2002) IEDM Tech. Dig. , pp. 639
- Hokazono, A.¹ Ohuchi, K.² Takayanagi, M.³ Watanabe, Y.⁴ Magoshi, S.⁵ Kato, Y.⁶ Shimizu, T.⁷

6
- 0036923256
- J.P. Lu, D. Miles, J. Zhao, A. Gurba, Y. Xu, C. Lin, M. Hewson et al., IEDM Tech. Dig. (2002), p. 371
- (2002) IEDM Tech. Dig. , pp. 371
- Lu, J.P.¹ Miles, D.² Zhao, J.³ Gurba, A.⁴ Xu, Y.⁵ Lin, C.⁶ Hewson, M.⁷

7
- 0001111214
- Z. Ma, L.H. Allen, Phys. Rev. B 49, 13501 (1994)
- (1994) Phys. Rev. B , vol.49 , pp. 13501
- Ma, Z.¹ Allen, L.H.²

8
- 0027703140
- K. Maex, Mater. Sci. Eng. R 11, 53 (1993)
- (1993) Mater. Sci. Eng. R , vol.11 , pp. 53
- Maex, K.¹

9
- 0037470335
- R.N. Huang, J.Y. Feng, Y. Huang, Appl. Surf. Sci. 207, 139 (2003)
- (2003) Appl. Surf. Sci. , vol.207 , pp. 139
- Huang, R.N.¹ Feng, J.Y.² Huang, Y.³

10
- 0035556722
- X.P. Qu, C. Detavernier, R.L. Van Meirhaeghe, F. Cardon, MRS Proc. 670, K6101-K6106 (2001)
- (2001) MRS Proc. , vol.670
- Qu, X.P.¹ Detavernier, C.² Van Meirhaeghe, R.L.³ Cardon, F.⁴

11
- 4344624913
- C. Detavernier, X.P. Qu, L. Van Meirhaeghe, J. Mater. Res. 18, 1675 (2003)
- (2003) J. Mater. Res. , vol.18 , pp. 1675
- Detavernier, C.¹ Qu, X.P.² Van Meirhaeghe, L.³

12
- 0035519420
- A. Lauwers, A. Steegen, M. de potter, R. Lindsay, A. Satta, H. Bender, K. Maex, J. Vac. Sci. Technol. B 19, 2026 (2001)
- (2001) J. Vac. Sci. Technol. B , vol.19 , pp. 2026
- Lauwers, A.¹ Steegen, A.² de potter, M.³ Lindsay, R.⁴ Satta, A.⁵ Bender, H.⁶ Maex, K.⁷

13
- 0036776680
- A. Lauwers, M. de Potter, O. Chamirian, R. Lindsay, C. Demeurisse, C. Vrancken, K. Maex, Microelectron. Eng. 64, 131 (2002)
- (2002) Microelectron. Eng. , vol.64 , pp. 131
- Lauwers, A.¹ de Potter, M.² Chamirian, O.³ Lindsay, R.⁴ Demeurisse, C.⁵ Vrancken, C.⁶ Maex, K.⁷

14
- 4344691172
- K.L Pey, P.S. Lee, D. Mangelinck, Thin Solid Films 462-463, 137 (2004)
- (2004) Thin Solid Films , vol.137 , pp. 462-463
- Pey, K.L.¹ Lee, P.S.² Mangelinck, D.³

15
- 28044454327
- J.A. Kittl, A. Lauwers, M.A. Pawlak, M. Van Dal, A. Veloso, K.G. Anil, G. Pourtois, C. Demeurisse, T. Schram, B. Brijs, M. De Potter, C. Vrancken, K. Maex, Microelectron. Eng. 82, 441 (2005)
- (2005) Microelectron. Eng. , vol.82 , pp. 441
- Kittl, J.A.¹ Lauwers, A.² Pawlak, M.A.³ Van Dal, M.⁴ Veloso, A.⁵ Anil, K.G.⁶ Pourtois, G.⁷ Demeurisse, C.⁸ Schram, T.⁹ Brijs, B.¹⁰ De Potter, M.¹¹ Vrancken, C.¹² Maex, K.¹³

16
- 0345222451
- A.S. Wang, D.Z. Chi, M. Loomans, D. Ma, M.Y. Lai, W.C. Tjiu, S.J. Chua, Appl. Phys. Lett. 81, 5138 (2002)
- (2002) J. Appl. Phys. Lett. , vol.81 , pp. 5138
- Wang, A.S.¹ Chi, D.Z.² Loomans, M.³ Ma, D.⁴ Lai, M.Y.⁵ Tjiu, W.C.⁶ Chua, S.⁷

17
- 0021444627
- F. Heurle, C.S. Petersson, J.E.E. Baglin, S.J. Placa, C.Y. Wong, J. Appl. Phys. 55, 4208 (1984)
- (1984) J. Appl. Phys. , vol.55 , pp. 4208
- Heurle, F.¹ Petersson, C.S.² Baglin, J.E.E.³ Placa, S.J.⁴ Wong, C.Y.⁵

18
- 5544306527
- J.A. Kittl, A. Lauwers, O. Chamirian, M.A. Pawlak, M. Van Dal, A. Akheyar, M. De Potter, A. Kottantharayil, G. Pourtois, R. Lindsay, K. Maex, Mater. Res. Soc., Symp. Proc. 810, 31 (2004)
- (2004) Mater. Res. Soc., Symp. Proc. , vol.810 , pp. 31
- Kittl, J.A.¹ Lauwers, A.² Chamirian, O.³ Pawlak, M.A.⁴ Van Dal, M.⁵ Akheyar, A.⁶ De Potter, M.⁷ Kottantharayil, A.⁸ Pourtois, G.⁹ Lindsay, R.¹⁰ Maex, K.¹¹

19
- 0142055828
- C. Lavoie, F.M. d'Heurle, C. Detavernier, C. Cabwral Jr., Microelectron. Eng. 70, 144 (2003)
- (2003) Microelectron. Eng. , vol.70 , pp. 144
- Lavoie, C.¹ d'Heurle, F.M.² Detavernier, C.³ Cabwral Jr., C.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.