Design and characterization of the EBG waveguide-based interconnects

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 2, 2007, Pages 163-170

  Suntives, Asanee ^a   Abhari, Ramesh ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

Crosstalk; Electromagnetic bandgap; Microstrip to waveguide transition; Novel interconnects; Substrate integrated waveguide; Via fence; Waveguide bends

Indexed keywords

CROSSTALK; ELECTROMAGNETS; MICROSTRIP DEVICES; OPTICAL INTERCONNECTS; OPTIMIZATION; PRINTED CIRCUITS; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES;

ELECTROMAGNETIC BANDGAP; MICROSTRIP-TO-WAVEGUIDE TRANSITION; NOVEL INTERCONNECTS; SUBSTRATE INTEGRATED WAVEGUIDE; WAVEGUIDE BENDS;

ENERGY GAP;

EID: 34249819651     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.895614     Document Type: Conference Paper

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