Fully integrated AC coupled interconnect using buried bumps

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2005, Issue , 2005, Pages 7-10

  Wilson, John ^a   Mick, Stephen ^a   Xu, Jian ^a   Luo, Lei ^a   Bonafede, Salvatore ^b   Huffman, Alan ^b   LaBennett, Richard ^b   Franzon, Paul ^a  

^a North Carolina State University   (United States)

^b RTI INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCI; BURIED BUMPS; INTEGRATED CHIPS; PACKAGE TECHNOLOGY;

CAPACITORS; DATA COMMUNICATION SYSTEMS; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS;

ELECTRIC CONNECTORS;

EID: 33845594694     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2005.1563686     Document Type: Conference Paper

References (7)

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