The use of metal filled via holes for improving isolation in ltcc rf and wireless multichip packages

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 1, 2000, Pages 88-99

  Ponchak, George E ^a   Chun, Donghoon ^b   Yook, Jong Gwan ^c  

^a NASA GLENN RESEARCH CENTER   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

^c Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

Coupling; Crosstalk; MCM; Microstrip; Microwave transmission lines; Stripline

Indexed keywords

CERAMIC MATERIALS; CROSSTALK; ELECTROMAGNETIC SHIELDING; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; MICROSTRIP LINES; MULTICHIP MODULES; SUBSTRATES;

LOW TEMPERATURE COFIRED CERAMICS (LTCC);

ELECTRONICS PACKAGING;

EID: 0033871250     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.826766     Document Type: Article

References (18)

1. R. W. Johnson, R. K. F. Teng, and J. W. Bälde, Multichip Modules Systems Advantages, Major Constructions, and Material Technologies. New York: IEEE Press, 1991.
2. R. L. Brown, P. W. Polinski, and A. S. Shaikh Manufacturing of microwave modules using low-temperature cofired ceramics," in Proc. 1994 IEEE MTT-D Int. Microwave Symp. Dig., 1994, pp. 1727-1730.
3. H. Sakai, Y. Ota, K. Inoue, T. Yoshida, K. Takahashi, S. Fujita, and M. Sagawa A novel millimeter-wave 1C on Si substrate using flip-chip bonding technology," in Proc. 1994 IEEE MTT-S Int. Microwave Symp. Dig., 1994, pp. 1763-1766.
4. G. White, E. Perfecto, D. McHerron, T. DeMercurio, T. Redmond, and M. Norcott Large format fabrication-A practical approach to low cost MCM-D," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 18, pp. 37-11, Feb. 1995.
5. R. A. Pillion, R. J. Wojnarowski, T. B. Gorcyzca, E. J. Wildi, and H. S. Cole Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 18, pp. 59-65, Feb. 1995.
6. R. W. Johnson, Modular series in hybrid microelectronics. Reston, VA: International Society for Hybrid Microelectronics, 1991.
7. N. G. Alexopoulos and S.-C. Wu Frequency-independent equivalent circuit model for microstrip open-end and gap discontinuities," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 1268-1272, July 1994.
8. R. E. Collin, Foundations for Microwave Engineering. New York: McGraw-Hill, 1992, pp. 164-175.
9. J. W. Gipprich EM modeling of via wall structures for high isolation stripline," in Proc. Dig. Workshop WWFC, Interconn. Packag. Technol. Issues, IEEE Int. Microwave Symp., San Diego, CA, June 1994, pp. 78-114.
10. J. Gipprich, C. Wilson, and D. Stevens Multilayered 3-D packaging issues," in Proc. Dig. Workshop WFC, Interconn. Packag. RF Wireless Commun. Syst., IEEE Int. Microwave Symp., Denver, CO, June 13, 1997.
11. J. Gipprich and D. Stevens Isolation characteristics of via structures in high density stripline packages," in Proc. Dig. Workshop WME, Multilayer Microwave Circ., IEEE Int. Microwave Symp., Baltimore, MD, June 12, 1998.
12. M.-K. Kim Crosstalk control for microstrip circuits in PCB's at microwave frequencies," in Proc. Int Symp. Electromagn. Compat., 1995, pp. 459-464.
13. G. E. Ponchak, D. Chen, J.-G. Yook, and L. P. B. Katehi Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages," IEEE MTT-S Int. Microwave Symp. Dig., pp. 1831-1834, 1998.
14. Filled via hole fences for crosstalk control of microstrip lines in LTCC packages," in Proc. 3rd Int. Wireless Commun. Conf. (WCC '98) Dig., San Diego, CA, Nov. 3, 1998, pp. 96-100.
15. Roc. IMAPS 199831stlnt. Symp. Microelectron., San Diego, CA, Nov. 4, 1998.
16. J.-G. Yook, N. Dib, and L. Katehi Characterization of high frequency interconnects using finite difference time domain and finite element methods," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 1727-1736, Sept. 1994.
17. R. Goyal, Monolithic Microwave Integrated Circuits: Technology & Design. Norwood, MA: Artech House, 1989, pp. 358-372.
18. G. E. Ponchak and L. P. B. Katehi Finite ground coplanar (FGC) waveguide: A better transmission line for microwave circuits," Adv. Microelectron., vol. 25, no. 3, pp. 15-18, May/June 1998.