Microwave characterization and modeling of multilayered cofired ceramic waveguides

International Journal of Microcircuits and Electronic Packaging

Volumn 22, Issue 1, 1999, Pages 43-48

  Stevens, Daniel ^a,b,c,d   Gipprich, John ^{a,c,d,e,f,g,h}  

^a NORTHROP GRUMMAN CORPORATION   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c WESTINGHOUSE ELECTRIC COMPANY   (United States)

^d Northrop Grumman's Electron S ^*  (United States)

^e Westinghouse/Johns Hopkins Wk S   (United States)

^f JOHNS HOPKINS UNIVERSITY   (United States)

^g Active Aperture Module Eng Dept

^h IEEE

Author keywords

[No Author keywords available]

Indexed keywords

LOW TEMPERATURE COFIRED CERAMICS (LTCC); MULTILAYERED COFIRED CERAMIC WAVEGUIDES;

CERAMIC MATERIALS; COMPUTER SIMULATION; CROSSTALK; ELECTROMAGNETIC WAVE REFLECTION; INSERTION LOSSES; MATHEMATICAL MODELS; RESONATORS; SUBSTRATES;

RECTANGULAR WAVEGUIDES;

EID: 0032686202     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. High Frequency Structure Simulator (HFSS), Hewlett Packard Company, Westlake, California.
2. Duroid, Rogers Corp., Chandler, Arizona.
3. Samuel Laio, "Microwave Devices and Circuits", pp. 102-119, Prentice Hall, 1990.
4. G. L. Mathaei, L. Young, and E.M.T Jones, "Microwave Filters, Impedance Matching Networks, and Coupling Structures", pg. 243, Artech House, Dedham, Massachusetts, 1985.
5. H. Uchimura, T. Takenoshita, and M. Fuji, "Development of the Laminated Waveguide", IEEE MTT-S Digest, pp. 1811-1814, 1998.