Characterizations of interconnects formed in electromagnetic bandgap substrates

Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005

Volumn 2005, Issue , 2005, Pages 75-78

  Suntives, Asanee ^a   Abhari, Ramesh ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BENCHMARKING; COMPUTER SIMULATION; ENERGY GAP; MICROSTRIP LINES; SUBSTRATES;

ELECTROMAGNETIC BANDGAP SUBSTRATES; INTERCONNECT GEOMETRIES; PROTOTYPE STRUCTURES;

ELECTROMAGNETISM;

EID: 33745486376     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2005.1500903     Document Type: Conference Paper

References (5)

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3. J. J. Simpson, A. Taflove, J. A. Mix, and H. Heck, "Computational and Experimental Study of a Microwave Electromagnetic Bandgap Structure With Waveguiding Defect for Potential Use as a Bandpass Wireless Interconnect," IEEE Microw. Wirel. Compon. Lett., Vol. 14, No. 7 (2004), pp 343-345.
4. D. Deslandes and K. Wu, "Single-Substrate Integration Techniques for Planar Circuits and Waveguide Filters," IEEE Trans. Microw. Theory Tech., Vol. 51, No. 2 (2003), pp. 593-596.
5. D. Deslandes and K. Wu, "Integrated Microstrip and Rectangular Waveguide in Planar Form," IEEE Microw. Wirel. Compon. Lett., Vol. 11, No. 2 (2001), pp 68-70.