Strength analysis of MEMS micromirror devices ∼ effects of loading mode and etching damage

Key Engineering Materials

Volumn 297-300 I, Issue , 2005, Pages 527-532

  Izumi, Satoshi ^a   Ping, Chan Wee ^a   Yamaguchi, Makoto ^a   Sakai, Shinsuke ^a   Suzuki, Atsushi ^b   Ueda, Yuzuru ^b  

^a UNIVERSITY OF TOKYO   (Japan)

^b NIPPON SIGNAL CO LTD   (Japan)

Author keywords

Brittle fracture; Finite element method and load factor; Fracture mechanics; MEMS

Indexed keywords

BENDING (DEFORMATION); BRITTLE FRACTURE; ETCHING; FINITE ELEMENT METHOD; FRACTURE MECHANICS; MATHEMATICAL MODELS;

ETCHING DAMAGE; FLAW POPULATION; FRACTURED STRESSES; LOAD FACTORS; MICROMIRROR DEVICES;

MEMS;

EID: 34249652335     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-978-4.527     Document Type: Conference Paper

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