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Besides the copper complexes and unpolymerized monomers, free poly(MPDSAH) might be generated in the solution phase by impurities that initiated the polymerization. The free poly(MPOSAH) could be deposited on the substrate and/or make complexes with poly(MPDSAH) that were grafted from the surface. Usually the generation of free polymers in the solution phase is characterized by the gelation of the reaction solution or the precipitation of polymers. Although we did not observe any changes in solution, a very small amount of free polymers could not be detected directly in solution or on the substrate. Therefore, we can not exclude completely the possibility that the thickness decrease was also caused by the removal of free poly(MPDSAH, Another possible explanation of the thickness decrease would be the desorption of poly(MPDSAH) grafted from the gold surface, which requires the cleavage of the Au-S bond. Although the Au-S bond was reported to be stable at 40°C J. Am. Chem. Soc
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Besides the copper complexes and unpolymerized monomers, free poly(MPDSAH) might be generated in the solution phase by impurities that initiated the polymerization. The free poly(MPOSAH) could be deposited on the substrate and/or make complexes with poly(MPDSAH) that were grafted from the surface. Usually the generation of free polymers in the solution phase is characterized by the gelation of the reaction solution or the precipitation of polymers. Although we did not observe any changes in solution, a very small amount of free polymers could not be detected directly in solution or on the substrate. Therefore, we can not exclude completely the possibility that the thickness decrease was also caused by the removal of free poly(MPDSAH). Another possible explanation of the thickness decrease would be the desorption of poly(MPDSAH) grafted from the gold surface, which requires the cleavage of the Au-S bond. Although the Au-S bond was reported to be stable at 40°C (J. Am. Chem. Soc. 1995, 117, 12528;
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