Back side thermal imaging of integrated circuits at high spatial resolution

Applied Physics Letters

Volumn 90, Issue 17, 2007, Pages

  Tessier, G ^a   Bardoux, M ^a   Bou C ^a   Filloy, C ^a   Fournier, D ^a  

^a CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; ELECTROMAGNETIC WAVE DIFFRACTION; HEATING; IMAGE RESOLUTION; INFRARED IMAGING; SEMICONDUCTING INDIUM GALLIUM ARSENIDE; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

NONCOHERENT ILLUMINATION; SPATIAL RESOLUTION; THERMOREFLECTANCE;

INTEGRATED CIRCUITS;

EID: 34248577713     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2732179     Document Type: Article

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