Lock-in thermal IR imaging using a solid immersion lens

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1508-1513

  Breitenstein, O ^a   Altmann, F ^b   Riediger, T ^b   Karg, D ^c   Gottschalk, V ^d  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^c Thermosensorik GmbH   (Germany)

^d ELMOS Semiconductor AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; IMAGE QUALITY; LENSES; LIGHT SCATTERING; OPTICAL RESOLVING POWER; SENSITIVITY ANALYSIS;

DETECTION LIMIT; IMAGE CONTRAST; IR CAMERA; SILICON SOLID IMMERSION LENS (SIL);

INFRARED IMAGING;

EID: 33747793355     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.027     Document Type: Article

References (9)

1. McDonald J. Optical and infrared FA microscopy. Tutorial at ISTFA 2005, see: www.quantumfocus.com/publications/2005_Optical_and_Infrared_FA_Microscopy.pdf.
2. Breitenstein O., Altmann F., Riediger T., and Karg D. Lock-in infrared microscopy with 1.4 μm resolution using a solid immersion lens. Electronic Device Failure Analysis 8 (2006) 4-13
3. Wu D., Rantala J., Karpen W., Zenzinger G., Schönbach B., Rippel W., Stegmüller R., Diener L., and Busse G. Application of Lock-in Thermography Methods. In: Thompson D.O., and Chimenti D.E. (Eds). Review of Progress in Quantitative Nondestructive Evaluation Vol. 15 (1996), Plenum Press, New York 511-518
4. Breitenstein O, Rakotoniaina JP, Altmann F, Schulz J, Linse G. Fault localization and functional testing of ICs by lock-in thermography. Int Symp Test & Failure Analysis (ISTFA), Nov. 2002, p. 29-36.
5. Colvin JB. Moiré Stabilized Thermal Imaging. Proc. 12th Int. Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2006, p. 163-6.
6. de la Bardonnie M, Ross R, Ly K, Lorut F, Lamy M, Wyon C, Kwakman LFTz, Hiruma Y, Roux J. The Effectiveness of OBIRCH Based Fault Isolation for Sub-90nm CMOS Technologies. Proc 31th Int Symposium for Testing and Failure Analysis (ISTFA), 2005, p. 49-58.
7. Breitenstein O., and Langenkamp M. Lock-in Thermography-Basics and Use for Functional Diagnostics of Electronic Components (2003), Springer, Heidelberg/New York. 3-540-43439-9
8. Breitenstein O, Rakotoniaina JP, Al Rifai MH, Gradhand M, Altmann F, Riediger T. New Developments in IR Lock-in IR Thermography. Proc 30th Int Symposium for Testing and Failure Analysis (ISTFA), Nov. 2004, p. 595-9.
9. www.thermosensorik.de.